SNP

V+

GND

D1

D2

D3

D5

D4

R1

ESD

Clamp

D6

D7

I/O

LM89

SNIS128D – AUGUST 2002 – REVISED JUNE 2014

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Table 1. ESD Protection(1) (continued)

Pin Name

PIN

D1

D2

D3

D4

D5

D6

D7

R1

SNP

ESD

NO.

CLAMP

ALERT

6

x

x

x

SMBData

7

x

x

x

SMBCLK

8

x

Figure 1. ESD Protection Input Structure

8 Specifications

8.1 Absolute Maximum Ratings

(1) (2)

MIN

MAX

UNIT

Supply Voltage

−0.3

6.0

V

Voltage at SMBData, SMBCLK, ALERT, T_CRIT_A

−0.5

6.0

V

Voltage at Other Pins

−0.3

V

D

− Input Current

-1

+1

mA

-5

+5

mA

30

mA

SMBData, ALERT, T_CRIT_A Output Sink Current

10

mA

Junction Temperature

150

°C

Soldering Information, Lead Temperature

Vapor Phase (60

seconds)

215

°C

Infrared (15 seconds)

220

°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not

apply when operating the device beyond its rated operating conditions.

(2)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(3)

mA. Parasitic components and or ESD protection circuitry are shown in Table 1 and Figure 1 for the LM89's pins. The nominal

breakdown voltage of D3 is 6.5 V. Care should be taken not to forward bias the parasitic diode, D1, present on pins: D+, D

−. Forward

biasing the parasitic diode by more than 50 mV may corrupt a temperature measurements.

(4)

Visit www.ti.com/packaging for other recommendations and methods of soldering surface mount devices.

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