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ams Datasheet

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[v1-04] 2015-Jun-19

AS1382 − Absolute Maximum R atings

Stresses beyond those listed under Absolute Maximum Ratings

may cause permanent damage to the device. These are stress

ratings only. Functional operation of the device at these or any

other conditions beyond those indicated under Electrical

Characteristics is not implied. Exposure to absolute maximum

rating conditions for extended periods may affect device

reliability.

Figure 5:

Absolute Maximum Ratings

Note(s) and/or Footnote(s):

1. Depending on actual PCB layout and PCB used

2. The reflow peak soldering temperature (body temperature) is specified according IPC/JEDEC J-STD-020 “Moisture/Reflow Sensitivity

Classification for Nonhermetic Solid State Surface Mount Devices”

Symbol

Parameter

Min

Max

Units

Comments

Electrical Parameters

Supply Voltage to Ground 5V pins

-0.5

7.0

V

Applicable for pins VIN, EN,

MODE, FB, SW

Input Current (latch-up immunity)

-100

100

mA

Norm: JEDEC JESD78

Continuous power dissipation

0.55

W

(1) for WL-CSP6 package

Electrostatic Discharge

Electrostatic Discharge HBM

±2

kV

Norm:

JEDEC JESD22-A114F

Temperature Ranges and Storage Conditions

Operating Temperature

-40

85

°C

Junction to Ambient Thermal

Resistance

95

°C/W

Junction Temperature

125

°C

Storage Temperature Range

-55

125

°C

Package Body Temperature

260

°C

Norm: IPC/JEDEC

J-STD-020 (2)

Relative Humidity

non-condensing

585

%

MSL

Moisture Sensitivity Level

1

Represents an unlimited

floor life time

Absolute Maximum Ratings