DLP9000 datasheet(49/56 Pages) TI1

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DLP9000

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DLPS036A – SEPTEMBER 2014 – REVISED OCTOBER 2015

13.5 Electrostatic Discharge Caution

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

13.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.

14 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

14.1 Thermal Characteristics

Achieving optimal DMD performance requires proper management of the maximum DMD case temperature, the

maximum temperature of any individual micromirror in the active array and the temperature gradient between

any two points on or within the package.

Refer to Absolute Maximum Ratings and Recommended Operating Conditions regarding applicable temperature

limits.

14.2 Package Thermal Resistance

The DMD is designed to conduct the absorbed and dissipated heat back to the series FLS package where it can

be removed by an appropriate thermal management system. The thermal management system must be capable

of maintaining the package within the specified operational temperatures at the thermal test point locations (refer

to Figure 15 or Micromirror Array Temperature Calculation). The total heat load on the DMD is typically driven by

the incident light absorbed by the active area; although other contributions can include light energy absorbed by

the window aperture, electrical power dissipation of the array, and parasitic heating. For the thermal resistance,

refer to Thermal Information.

14.3 Case Temperature

The temperature of the DMD case can be measured directly. For consistency, a thermal test point location is

defined as shown in Figure 15 and Micromirror Array Temperature Calculation.

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