SN54HC74 datasheet(5/15 Pages) TI1

5 / 15 page

SN54HC74, SN74HC74

www.ti.com

SCLS094E – DECEMBER 1982 – REVISED DECEMBER 2015

6.4 Thermal Information

SN74HC74

SN54HC74

THERMAL METRIC(1)

UNIT

(SOIC)

(SSOP) (PDIP)

(SO)

(TSSOP) (CDIP)

(CFP)

(LCCC)

14 PINS

20 PINS

RθJA

Junction-to-ambient thermal resistance

113

—

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

—

15.05

14.65

5.61

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6.5 Electrical Characteristics

over recommended operating free-air temperature range, TA = 25°C (unless otherwise noted)

PARAMETER

TEST CONDITIONS

VCC

MIN

TYP

MAX

UNIT

2 V

1.9

1.998

IOH = –20 µA

4.5 V

4.4

4.499

6 V

5.9

5.999

TA = 25°C

3.98

4.3

VOH

VI = VIH or VIL

IOH = –4 mA

SN54HC74

4.5 V

3.7

SN74HC74

3.84

TA = 25°C

5.48

5.8

IOH = –5.2 mA

SN54HC74

6 V

5.2

SN74HC74

5.34

2 V

0.002

0.1

IOL = 20 µA

4.5 V

0.001

0.1

6 V

0.001

0.1

TA = 25°C

0.17

0.26

VOL

VI = VIH or VIL

IOL = 4 mA

SN54HC74

4.5 V

0.4

SN74HC74

0.33

TA = 25°C

0.15

0.26

IOL = 5.2 mA

SN54HC74

6 V

0.4

SN74HC74

0.33

VI = VCC or 0

TA = 25°C

±0.1

±100

6 V

SN54HC74,

±1000

SN74HC74

VI = VCC or 0,

IO = 0

TA = 25°C

ICC

SN54HC74

6 V

µA

SN74HC74

2 V to 6 V

Cpd

No load

2 V to 6 V

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