DRV8301DCA datasheet(29/39 Pages) TI1

29 / 39 page

DRV8301

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SLOS719F – AUGUST 2011 – REVISED JANUARY 2016

Product Folder Links: DRV8301

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10 Layout

10.1 Layout Guidelines

Use these layout recommendations when designing a PCB for the DRV8301.

•

The DRV8301 makes an electrical connection to GND through the PowerPAD. Always check to ensure that

the PowerPAD has been properly soldered (See PowerPAD™ Thermally Enhanced Package application

report, SLMA002).

•

PVDD bypass capacitors should be placed close to their corresponding pins with a low impedance path to

device GND (PowerPAD).

•

GVDD bypass capacitor should be placed close its corresponding pin with a low impedance path to device

GND (PowerPAD).

•

AVDD and DVDD bypass capacitors should be placed close to their corresponding pins with a low-impedance

path to the AGND pin. It is preferable to make this connection on the same layer.

•

AGND should be tied to device GND (PowerPAD) through a low impedance trace/copper fill.

•

Add stitching vias to reduce the impedance of the GND path from the top to bottom side.

•

Try to clear the space around and underneath the DRV8301 to allow for better heat spreading from the

PowerPAD.

DRV8301DCA Datasheet(PDF) 29 Page - Texas Instruments