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DRV8301DCA Datasheet(PDF) 7 Page - Texas Instruments

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Part # DRV8301DCA
Description  Three-Phase Gate Driver
PDF  39 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

DRV8301DCA Datasheet(HTML) 7 Page - Texas Instruments

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7
DRV8301
www.ti.com
SLOS719F – AUGUST 2011 – REVISED JANUARY 2016
Product Folder Links: DRV8301
Submit Documentation Feedback
Copyright © 2011–2016, Texas Instruments Incorporated
6.3 Recommended Operating Conditions
MIN
MAX
UNIT
VPVDD1
DC supply voltage PVDD1 for normal operation
Relative to PGND
6
60
V
VPVDD2
DC supply voltage PVDD2 for buck converter
3.5
60
V
IDIN_EN
Input current of digital pins when EN_GATE is high
100
µA
IDIN_DIS
Input current of digital pins when EN_GATE is low
1
µA
CO_OPA
Maximum output capacitance on outputs of shunt amplifier
20
pF
RDTC
Dead time control resistor range. Time range is 50 ns (-GND) to 500 ns (150 k
Ω) with a linear
approximation.
0
150
k
Ω
IFAULT
nFAULT pin sink current, open-drain
V = 0.4 V
2
mA
IOCTW
nFAULT pin sink current, open-drain
V = 0.4 V
2
mA
VREF
External voltage reference voltage for current shunt amplifiers
2
6
V
ƒgate
Operating switching frequency of gate driver
Qg(TOT) = 25 nC or total 30-mA gate
drive average current
200
kHz
Igate
Total average gate drive current
30
mA
TA
Ambient temperature
–40
125
°C
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
6.4 Thermal Information
THERMAL METRIC(1)
DRV8301
UNIT
DCA (HTSSOP)
56 PINS
RθJA
Junction-to-ambient thermal resistance
30.3
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
33.5
°C/W
RθJB
Junction-to-board thermal resistance
17.5
°C/W
ψJT
Junction-to-top characterization parameter
0.9
°C/W
ψJB
Junction-to-board characterization parameter
7.2
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
0.9
°C/W



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