LMP8271 datasheet(2/17 Pages) TI1

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OBSOLETE

LMP8271

SNOSAP6H – JUNE 2005 – REVISED APRIL 2013

www.ti.com

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

ABSOLUTE MAXIMUM RATINGS

(1) (2)

ESD Tolerance (3)

Human Body Model

For input pins only

±4000V

For All other pins

±2000V

Machine Model

200V

Supply Voltage (VS - GND)

5.75V

Common Mode Voltage on +IN and

−IN

Transient (400 ms)

−7V to 45V

Storage Temperature Range

−65°C to +150°C

Junction Temperature (4)

+150°C max

Soldering Information

Infrared or Convection (20 sec)

235°C

Wave Soldering Lead Temp. (10 sec)

260°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test

conditions, see the Electrical Characteristics Tables.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(3)

Human Body Model is 1.5 k

Ω in series with 100 pF. Machine Model is 0Ω in series with 200 pF.

(4)

The maximum power dissipation is a function of TJ(MAX), θJA, and TA. The maximum allowable power dissipation at any ambient

temperature is PD = (TJ(MAX) - TA)/ θJA. All numbers apply for packages soldered directly onto a PC board.

OPERATING RATINGS

(1)

Temperature Range

Packaged Devices (2)

−40°C to +125°C

Supply Voltage (VS – GND)

4.75V to 5.5V

Package Thermal Resistance (

θJA

(2))

8-Pin SOIC

190°C/W

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test

conditions, see the Electrical Characteristics Tables.

(2)

The maximum power dissipation is a function of TJ(MAX), θJA, and TA. The maximum allowable power dissipation at any ambient

temperature is PD = (TJ(MAX) - TA)/ θJA. All numbers apply for packages soldered directly onto a PC board.

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