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TLV809

SLVSA03D – JUNE 2010 – REVISED MARCH 2016

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Table of Contents

1

Features .................................................................. 1

2

Applications ........................................................... 1

3

Description ............................................................. 1

4

Revision History..................................................... 2

5

Voltage Options ..................................................... 3

6

Pin Configuration and Functions ......................... 3

7

Specifications......................................................... 3

7.1

Absolute Maximum Ratings ...................................... 3

7.2

ESD Ratings.............................................................. 4

7.3

Recommended Operating Conditions ....................... 4

7.4

Thermal Information .................................................. 4

7.5

Electrical Characteristics........................................... 4

7.6

Timing Requirements ................................................ 5

7.7

Switching Characteristics .......................................... 5

7.8

Typical Characteristics .............................................. 6

8

Detailed Description .............................................. 7

8.1

Overview ................................................................... 7

8.2

Functional Block Diagram ......................................... 7

8.3

Feature Description................................................... 7

8.4

Device Functional Modes.......................................... 7

9

Application and Implementation .......................... 8

9.1

Application Information.............................................. 8

9.2

Typical Application .................................................... 9

10

Power Supply Recommendations ..................... 10

11

Layout................................................................... 10

11.1

Layout Guidelines ................................................. 10

11.2

Layout Example .................................................... 10

12

Device and Documentation Support ................. 11

12.1

Documentation Support ........................................ 11

12.2

Community Resources.......................................... 11

12.3

Trademarks ........................................................... 11

12.4

Electrostatic Discharge Caution ............................ 11

12.5

Glossary ................................................................ 11

13

Mechanical, Packaging, and Orderable

Information ........................................................... 11

4 Revision History

Changes from Revision C (February 2012) to Revision D

Page

•

Added Device Information table, Pin Configuration and Functions section, ESD Ratings table, Overview section,

Feature Description section, Device Functional Modes section, Application and Implementation section, Power

Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical,

Packaging, and Orderable Information section ...................................................................................................................... 1

•

Deleted pinout drawing from page 1 ..................................................................................................................................... 1

•

Changed Description section: added third paragraph and changed section wording for clarity ............................................ 1

•

Changed Voltage Options table: changed title, deleted duplicated data already in POA ..................................................... 3

•

Deleted soldering temperature parameter from Absolute Maximum Ratings table ............................................................... 3

•

Changes from Revision B (September 2010) to Revision C

Page

•

Changed TLV809L30 DBZ ordering information column in Package/Ordering Information table.......................................... 3

•

Changed TLV809K33 DBZ ordering information column in Package/Ordering Information table ......................................... 3

•

Changed first TLV809I50 DBZ ordering information entry in Package/Ordering Information table ....................................... 3

Changes from Revision A (July 2010) to Revision B

Page

•

Updated document format to current standards..................................................................................................................... 1

•

Added DBZ package to pinout figure ..................................................................................................................................... 1

•

Added DBZ package to Package/Ordering Information table ................................................................................................ 3

•

Added Thermal Information table ........................................................................................................................................... 3

•

Changed Figure 3 ................................................................................................................................................................... 6