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ADG5413F Datasheet(PDF) 13 Page - Analog Devices

Part # ADG5413F
Description  Fault Protection and Detection, 10 ohm RON, Quad SPST Switches
PDF  28 Pages
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

ADG5413F Datasheet(HTML) 13 Page - Analog Devices

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Data Sheet
ADG5412F/ADG5413F
Rev. B | Page 13 of 28
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
Figure 3. TSSOP Pin Configuration
Figure 4. LFCSP Pin Configuration
Table 7. Pin Function Descriptions
Pin No.
Mnemonic
Description
TSSOP
LFCSP
1
15
IN1
Logic Control Input.
2
16
D1
Drain Terminal. This pin can be an input or an output.
3
1
S1
Overvoltage Protected Source Terminal. This pin can be an input or an output.
4
2
VSS
Most Negative Power Supply Potential.
5
3
GND
Ground (0 V) Reference.
6
4
S4
Overvoltage Protected Source Terminal. This pin can be an input or an output.
7
5
D4
Drain Terminal. This pin can be an input or an output.
8
6
IN4
Logic Control Input.
9
7
IN3
Logic Control Input.
10
8
D3
Drain Terminal. This pin can be an input or an output.
11
9
S3
Overvoltage Protected Source Terminal. This pin can be an input or an output.
12
10
FF
Fault Flag Digital Output. This pin has a high output when the device is in normal operation or a low
when a fault condition occurs on any of the Sx inputs.
13
11
VDD
Most Positive Power Supply Potential.
14
12
S2
Overvoltage Protected Source Terminal. This pin can be an input or an output.
15
13
D2
Drain Terminal. This pin can be an input or an output.
16
14
IN2
Logic Control Input.
EP
Exposed
Pad
The exposed pad is internally connected. For increased reliability of the solder joints and maximum
thermal capability, it is recommended that the pad be connected to the lowest supply voltage, VSS.
Table 8. ADG5412F Truth Table
INx
Switch Condition (S1 to S4)
1
On
0
Off
Table 9. ADG5413F Truth Table
INx
Switch Condition
S1, S4
S2, S3
0
Off
On
1
On
Off
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
D1
S1
VSS
D4
S4
GND
IN1
D2
S2
VDD
D3
IN4
IN3
S3
FF
IN2
ADG5412F/
ADG5413F
TOP VIEW
(Not to Scale)
NOTES:
1. THE EXPOSED PAD IS INTERNALLY CONNECTED. FOR
INCREASED RELIABILITY OF THE SOLDER JOINTS AND
MAXIMUM THERMAL CAPABILITY, IT IS RECOMMENDED
THAT THE PAD BE CONNECTED TO THE LOWEST
SUPPLY VOLTAGE, VSS.
12
11
10
1
3
4
9
2
S1
VSS
GND
S4
S2
VDD
FF
S3
ADG5412F/
ADG5413F
TOP VIEW
(Not to Scale)



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