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ADG5413F Datasheet(PDF) 23 Page - Analog Devices

Part # ADG5413F
Description  Fault Protection and Detection, 10 ohm RON, Quad SPST Switches
PDF  28 Pages
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

ADG5413F Datasheet(HTML) 23 Page - Analog Devices

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Data Sheet
ADG5412F/ADG5413F
Rev. B | Page 23 of 28
TERMINOLOGY
IDD
IDD represents the positive supply current.
ISS
ISS represents the negative supply current.
VD, VS
VD and VS represent the analog voltage on the Dx pins and the
Sx pins, respectively.
RON
RON represents the ohmic resistance between the Dx pins and
the Sx pins.
∆RON
∆RON represents the difference between the RON of any two
channels.
RFLAT(ON)
RFLAT(ON) is the flatness that is defined as the difference between
the maximum and minimum value of on resistance measured
over the specified analog signal range.
IS (Off)
IS (Off) is the source leakage current with the switch off.
ID (Off)
ID (Off) is the drain leakage current with the switch off.
ID (On), IS (On)
ID (On) and IS (On) represent the channel leakage currents with
the switch on.
VINL
VINL is the maximum input voltage for Logic 0.
VINH
VINH is the minimum input voltage for Logic 1.
IINL, IINH
IINL and IINH represent the low and high input currents of the
digital inputs.
CD (Off)
CD (Off) represents the off switch drain capacitance, which is
measured with reference to ground.
CS (Off)
CS (Off) represents the off switch source capacitance, which is
measured with reference to ground.
CD (On), CS (On)
CD (On) and CS (On) represent on switch capacitances, which
are measured with reference to ground.
CIN
CIN is the digital input capacitance.
tON
tON represents the delay between applying the digital control
input and the output switching on (see Figure 47).
tOFF
tOFF represents the delay between applying the digital control
input and the output switching off (see Figure 47).
tD
tD represents the off time measured between the 90% point of
both switches when switching from one address state to
another.
tDIGRESP
tDIGRESP is the time required for the FF pin to go low (0.3 V),
measured with respect to voltage on the source pin exceeding
the supply voltage by 0.5 V.
tDIGREC
tDIGREC is the time required for the FF pin to return high,
measured with respect to voltage on the Sx pin falling below the
supply voltage plus 0.5 V.
tRESPONSE
tRESPONSE represents the delay between the source voltage
exceeding the supply voltage by 0.5 V and the drain voltage
falling to 90% of the supply voltage.
tRECOVERY
tRECOVERY represents the delay between an overvoltage on the Sx
pin falling below the supply voltage plus 0.5 V and the drain
voltage rising from 0 V to 10% of the supply voltage.
Off Isolation
Off isolation is a measure of unwanted signal coupling through
an off switch.
Charge Injection
Charge injection is a measure of the glitch impulse transferred
from the digital input to the analog output during switching.
Channel-to-Channel Crosstalk
Crosstalk is a measure of unwanted signal that is coupled
through from one channel to another as a result of parasitic
capacitance.
−3 dB Bandwidth
Bandwidth is the frequency at which the output is attenuated
by 3 dB.
On Response
On response is the frequency response of the on switch.
Insertion Loss
Insertion loss is the loss due to the on resistance of the switch.
Total Harmonic Distortion Plus Noise (THD + N)
THD + N is the ratio of the harmonic amplitude plus noise of
the signal to the fundamental.



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