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SP6650 Datasheet(PDF) 15 Page - Sipex Corporation |
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SP6650 Datasheet(HTML) 15 Page - Sipex Corporation |
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15 / 17 page ![]() 15 Date: 5/25/04 SP6650 High Efficiency 600mA Synchronous Buck Regulator © Copyright 2004 Sipex Corporation Layout Considerations Proper layout is a very important part of the on- board power supply, affecting normal function- ality of the DC-DC converter itself and EMI. Because of the high frequency switching of the converter, the traces that couple an electric field can conduct currents under the AC voltages across the parasitic capacitance. Magnetic field coupling traces can induce currents like trans- formers. To avoid an excessive interference between the converter and the other active components on the board, some rules should be followed. Avoid injecting noise into the sensitive part of the circuit via the GND Plane. Input and output capacitors conduct the current through the GND Plane and high frequency components of the current can degrade the sensitive circuitry. Sepa- rate the power and signal grounds and connect them at one point to minimize the noise injected from the power ground to the signal ground. "Star" connection of the ground traces is shown on Figure 26, where GND is the minus pole of the output capacitor. Power loops on the input and output of the converter should be laid out with the shortest and widest traces possible. The longer and narrower the trace, the higher the resistance and induc- tance it will have. The AC current in long traces radiates EMI noise affecting the sensitive cir- cuits. The length of traces in series with the capacitors increases its ESR and ESL and reduc- ing their effectiveness at high frequencies. There- fore put the input capacitor as close to the appropri- ate pins of the converter as possible and output capacitor close to the inductor. The external voltage feed back network should be placed very close to the FB pin as well as bypass capacitor C4. Any noise traces like the Lx pin should be kept away from the voltage feed back network and separated from it by using power ground copper to minimize EMI. Figure 21. Application circuit with highlighted power traces. GND_ SIGNAL FB SDN GND PGND BLON VOUT VIN ILIM PVIN LX SP6650 2.7 - 6.5V DC C1 1µF C2 47µF + R1 10Ω C4 470pF R2 100kΩ R3 100kΩ 47µF C3 + 2.5V 1 2 3 4 5 6 7 8 9 10 3 1 L1 22µH 100k |
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