LM3556 datasheet(4/39 Pages) TI1

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LM3556

SNVS796D – AUGUST 2011 – REVISED OCTOBER 2015

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

VIN, VSW ,VOUT

–0.3

VSCL, VSDA, VENABLE, VSTROBE, VTX, VTORCH, VLED, VTEMP

−0.3 V to the lesser of (VIN + 0.3 V)

w/ 6 V maximum

Continuous power dissipation(3)

Internally limited

Junction temperature, TJ-MAX

150

°C

Maximum lead temperature (soldering)

See(4)

°C

Storage temperature, Tstg

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are with respect to the potential at the GND pin.

(3)

Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 150°C (typical) and

disengages at TJ = 135°C (typical). Thermal shutdown is ensured by design.

(4)

For detailed soldering specifications and information, refer to Texas Instruments Application Note 1112: DSBGA Wafer Level chip Scale

Package (SNVA009).

6.2 ESD Ratings

VALUE

UNIT

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±1000

V(ESD)

Electrostatic discharge

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±250

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

NOM

MAX

UNIT

VIN

2.5

5.5

Junction temperature, TJ

−40

125

°C

Ambient temperature, TA

(2)

−40

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP =

125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to-ambient thermal resistance of the

part/package in the application (RθJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (RθJA × PD-MAX).

6.4 Thermal Information

LM3556

THERMAL METRIC(1)

YFQ (DSBGA)

UNIT

16 PINS

RθJA

(2)

Junction-to-ambient thermal resistance

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

(2)

Junction-to-ambient thermal resistance (RθJA) is taken from a thermal modeling result, performed under the conditions and guidelines

set forth in the JEDEC standard JESD51-7. The test board is a 4-layer FR-4 board measuring 102 mm × 76 mm × 1.6 mm with a 2 × 1

array of thermal vias. The ground plane on the board is 50 mm × 50 mm. Thickness of copper layers are 36 µm/18 µm/18 µm/36 µm

(1.5 oz/1 oz/1 oz/1.5 oz). Ambient temperature in simulation is 22°C, still air. Power dissipation is 1 W.

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