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AD7768BSTZ Datasheet(PDF) 21 Page - Analog Devices

Part # AD7768BSTZ
Description  8-/4-Channel, 24-Bit, Simultaneous Sampling ADCs with Power Scaling, 110.8 kHz BW
PDF  99 Pages
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

AD7768BSTZ Datasheet(HTML) 21 Page - Analog Devices

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Data Sheet
AD7768/AD7768-4
Rev. A | Page 21 of 99
ABSOLUTE MAXIMUM RATINGS
Table 7.
Parameter
Rating
AVDD1, AVDD2 to AVSS1
−0.3 V to +6.5 V
AVDD1 to DGND
−0.3 V to +6.5 V
IOVDD to DGND
−0.3 V to +6.5 V
IOVDD, DREGCAP to DGND (IOVDD Tied
to DREGCAP for 1.8 V Operation)
−0.3 V to +2.25 V
IOVDD to AVSS
−0.3 V to +7.5 V
AVSS to DGND
−3.25 V to +0.3 V
Analog Input Voltage to AVSS
−0.3 V to AVDD1 + 0.3 V
Reference Input Voltage to AVSS
−0.3 V to AVDD1 + 0.3 V
Digital Input Voltage to DGND
−0.3 V to IOVDD + 0.3 V
Digital Output Voltage to DGND
−0.3 V to IOVDD + 0.3 V
Operating Temperature Range
−40°C to +105°C
Storage Temperature Range
−65°C to +150°C
Pb-Free Temperature, Soldering
Reflow (10 sec to 30 sec)
260°C
Maximum Junction Temperature
150°C
Maximum Package Classification
Temperature
260°C
1
Transient currents of up to 100 mA do not cause SCR latch-up.
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
θJA is specified for the worst case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 8. Thermal Resistance
Package Type
θJA
θJC
Unit
JEDEC Board Layers
64-Lead LQFP
38
9.2
°C/W
2P2S1
1
2P2S is a JEDEC standard PCB configuration per JEDEC Standard JESD51-7.
ESD CAUTION



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