RT1650WSC datasheet(23/26 Pages) RICHTEK

23 / 26 page

RT1650

is a registered trademark of Richtek Technology Corporation.

DS1650-00

July

2015

www.richtek.com

Firmware Setting

Please refer to another document for detailed description

of firmware setting.

Thermal Considerations

For continuous operation, do not exceed absolute

maximum junction temperature. The maximum power

dissipation depends on the thermal resistance of the IC

package, PCB layout, rate of surrounding airflow, and

difference between junction and ambient temperature.

The maximum power dissipation can be calculated by

the following formula :

PD(MAX) = (TJ(MAX)  TA) / JA

where TJ(MAX) is the maximum junction temperature,

TA is the ambient temperature, and JA is the junction to

ambient thermal resistance.

For recommended operating condition specifications,

the maximum junction temperature is 125

C. The

junction to ambient thermal resistance,

JA, is layout

dependent. For WL-CSP-48B 3x3.4 package, the

thermal resistance,

JA, is 27.2C/W on a standard

JEDEC 51-7 four-layer thermal test board. The

maximum power dissipation at TA = 25C can be

calculated by the following formula :

PD(MAX) = (125C  25C) / (27.2C/W) = 3.67W for

WL-CSP-48B 3x3.4 package

The maximum power dissipation depends on the

operating ambient temperature for fixed TJ(MAX) and

thermal resistance,

JA. The derating curve in Figure

16 allows the designer to see the effect of rising

ambient

temperature

the

maximum

power

dissipation.

Figure 16. Derating Curve of Maximum Power

Dissipation

Layout Considerations

the

PCB

layout

guidelines

for

optimal

performance of the IC.



Keep the traces of main current paths as short and

wide as possible.



Place the capacitors as close as possible to the IC.



Power ground should be as large as possible and

connected to a power plane for thermal dissipation.

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

100

125

Ambient Temperature (°C)

Four-Layer PCB

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