45738 Northport Loop West, Fremont, CA 94538

Phone: (510) 979-8999

Fax: (510) 979-8902

www.eiccorp.com

3

Revision A

SS-000536-000

ECP200

2.0 WATT POWER AMPLIFIER

PRELIMINARY DATA SHEET

3. UNIT = INCH

2. MOLD FLASH, PROTRUSIONS AND GATE BURRS

AT THE END OF THE PACKAGE BODY SHALL NOT

EXCEED 0.006" PER SIDE.

1. EXPOSED DIE PAD AREA MAY VARY.

DIE PAD SIZE IS BASED ON L/F PAD SIZE.

NOTES: UNLESS OTHERWISE SPECIFIED

0.236±0.008

0.016±0.003

0.050 BSC

0.194±0.003

7°±1°

3

4

5

6

7

8

2

1

BOTTOM VIEW

EXPOSED

DIE PAD

0.080

0.080

0.016±0.002

0.154±0.002

0.151±0.002

0.059±0.006

0.010 MAX

0.023±0.004

SOIC-8 Package Outline

Pin Definitions

PIN

FUNCTION

DEFINITION

1

Vref/pd

This pin sets the reference / quiescient current.

2,4,5

GND

These pins provide ground as well as the slug which is required for heat sinking.

3RF in

This pin connects to the input of the amplifier. It will have a dc voltage around

1.25 to 1.3 VDC. External circuit should provide DC blocking.

6,7

RF out

These are the output pins, which connects to the collector of the transistor. On

the PCB, the two pins should also be tied together. Vcc connects to these

through an inductor. A DC blocking capacitor is required.

8Vbias

This pin provides current to the bias circuit , typically Vbias = Vcc. Bypass

capacitors should be placed as close as practically possible to this pin.