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3967 Datasheet(PDF) 8 Page - Allegro MicroSystems |
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3967 Datasheet(HTML) 8 Page - Allegro MicroSystems |
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8 / 16 page ![]() 115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 (508) 853-5000 3967 MICROSTEPPING DRIVER WITH TRANSLATOR 8 Layout. The printed wiring board should use a heavy ground plane. For optimum electrical and thermal performance, the driver should be soldered directly onto the board. The load supply terminal, VBB, should be decoupled with an electrolytic capacitor (>47 µF is recommended) placed as close to the device as possible. To avoid problems due to capacitive coupling of the high dv/dt switching transients, route the bridge-output traces away from the sensitive logic-input traces. Always drive the logic inputs with a low source impedance to increase noise immunity. Grounding. A star ground system located close to the driver is recommended. The 24-lead SOIC has the analog ground and the power ground internally bonded to the power tabs of the package (leads 6, 7, 18, and 19). Applications Information Current Sensing. To minimize inaccuracies caused by ground-trace IR drops in sensing the output current level, the current-sense resistor (RS) should have an independent ground return to the star ground of the device. This path should be as short as possible. For low-value sense resistors the IR drops in the printed wiring board sense resistor’s traces can be significant and should be taken into account. The use of sockets should be avoided as they can introduce variation in RS due to their contact resistance. Allegro MicroSystems recommends a value of RS given by RS = 0.5/ITRIPmax Thermal protection. Circuitry turns off all drivers when the junction temperature reaches 165 °C, typically. It is intended only to protect the device from failures due to excessive junction temperatures and should not imply that output short circuits are permitted. Thermal shut- down has a hysteresis of approximately 15 °C. *RθJA = 35°C/W on JEDEC standard “High-K” four-layer board per JESD 51-7. †RθJA = 50°C/W on typical two-sided PCB with 1.3 square inches copper ground on each side. See also, Application Note 29501.5, Improving Batwing Power Dissipation. |
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