LM3424 datasheet(4/69 Pages) TI1

4 / 69 page

LM3424, LM3424-Q1

SNVS603C – AUGUST 2009 – REVISED AUGUST 2015

www.ti.com

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

VIN, EN, nDIM

–0.3

OVP, HSP, HSN

–0.3

–2 for 100 ns

VCC

–0.3

Voltage

VS, TREF, TSENSE, TGAIN, COMP, CSH,

–0.3

RT, SLOPE, SS

–0.3

VCC

GATE, DDRV

–2.5 for 100 ns

VCC + 2.5 for 100 ns

–0.3

0.3

GND

–2.5 for 100 ns

2.5 for 100 ns

VIN, EN, nDIM

–1

OVP, HSP, HSN

–100

µA

Continuous current

–1

–30

µA

GATE, DDRV

–1

Continuous power dissipation

Internally Limited

Maximum Junction Temperature

Internally Limited

°C

Maximum lead temperature (Reflow and Solder)(3)

260

°C

Storage temperature

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and

specifications.

(3)

Refer toTI’s packaging website for more detailed information and mounting techniques. http://www.ti.com/analogpackaging

6.2 ESD Ratings—LM3424

VALUE

UNIT

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)

±2500

Electrostatic

V(ESD)

Charged device model (CDM), per JEDEC specification JESD22-C101, all

discharge

±1000

pins(2)

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 ESD Ratings—LM3424-Q1

VALUE

UNIT

Human-body model (HBM), per AEC Q100-002(1)

±2500

Electrostatic

V(ESD)

discharge

Charged-device model (CDM), per AEC Q100-011

±1000

(1)

AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.4 Recommended Operating Conditions

MIN

MAX

UNIT

Operating Ambient Temperature Range

–40

125

°C

Input Voltage VIN

4.5

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