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LM3557 Datasheet(PDF) 12 Page - Texas Instruments |
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LM3557 Datasheet(HTML) 12 Page - Texas Instruments |
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12 / 19 page ![]() LM3557 SNVS338B – NOVEMBER 2004 – REVISED FEBRUARY 2013 www.ti.com OUTPUT CAPACITOR SELECTION The output capacitor serves as an energy reservoir for the white LED load when the internal power FET switch (Figure 3: N1) is ON or conducting current. The requirements for the output capacitor must include worst case operation such as when the load opens up and the LM3557 operates in over-voltage protection (OVP) mode operation. A minimum capacitance of 0.5 µF is required to ensure normal operation. Consult the capacitor manufacturer’s data curves to verify whether the minimum capacitance requirement is going to be achieved for a particular application. Some recommended capacitor manufacturers are: TDK [www.tdk.com] Murata [www.murata.com] Vishay [www.vishay.com] DIODE SELECTION To maintain high efficiency it is recommended that the average current rating (IF or IO) of the selected diode should be larger than the peak inductor current (ILpeak). To maintain diode integrity the peak repetitive forward current (IFRM) must be greater than or equal to the peak inductor current (ILpeak). Diodes with low forward voltage ratings (VF) and low junction capacitance magnitudes (CJ or CT or CD) are conducive to high efficiency. The chosen diode must have a reverse breakdown voltage rating (VR and/or VRRM) that is larger than the output voltage (VOUT). No matter what type of diode is chosen, Schottky or not, certain selection criteria must be followed: 1. VR and VRRM > VOUT 2. IF or IO ≥ ILOAD or IOUT 3. IFRM ≥ ILpeak Some recommended diode manufacturers are as follows: Vishay [www.vishay.com] Diodes, Inc [www.diodes.com] On Semiconductor [www.onsemi.com] LAYOUT CONSIDERATIONS All components, except for the white LEDs, must be placed as close as possible to the LM3557. The die attach pad (DAP) must be soldered to the ground plane. The input capacitor, Cin, must be placed close to the LM3557. Placing Cin close to the device will reduce the metal trace resistance effect on input voltage ripple. The feedback current setting resistor R2 must be placed close to the Fb and Sw2 pins. The output capacitor, Cout, must be placed close to the Ovp and Gnd pin connections. Trace connections to the inductor should be short and wide to reduce power dissipation, increase overall efficiency, and reduce EMI radiation. The diode, like the inductor, should have trace connections that are short and wide to reduce power dissipation and increase overall efficiency. For more details regarding layout guidelines for switching regulators refer to Applications Note AN-1149 (SNVA021). 12 Submit Documentation Feedback Copyright © 2004–2013, Texas Instruments Incorporated Product Folder Links: LM3557 |
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