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LM7301IM Datasheet(PDF) 2 Page - Texas Instruments

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Part # LM7301IM
Description  LM7301 Low Power, 4-MHz GBW, Rail-to-Rail Input-Output Operational Amplifier in SOT-23 Package
PDF  28 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

LM7301IM Datasheet(HTML) 2 Page - Texas Instruments

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LM7301
SNOS879I – AUGUST 1999 – REVISED MAY 2016
www.ti.com
Product Folder Links: LM7301
Submit Documentation Feedback
Copyright © 1999–2016, Texas Instruments Incorporated
Table of Contents
1
Features .................................................................. 1
2
Applications ........................................................... 1
3
Description ............................................................. 1
4
Revision History..................................................... 2
5
Pin Configuration and Functions ......................... 3
6
Specifications......................................................... 4
6.1
Absolute Maximum Ratings ...................................... 4
6.2
ESD Ratings.............................................................. 4
6.3
Recommended Operating Conditions ....................... 4
6.4
Thermal Information .................................................. 4
6.5
Electrical Characteristics: 5-V DC............................. 5
6.6
Electrical Characteristics: AC.................................... 6
6.7
Electrical Characteristics: 2.2-V DC.......................... 6
6.8
Electrical Characteristics: 30-V DC........................... 7
6.9
Typical Characteristics .............................................. 9
7
Detailed Description ............................................ 12
7.1
Overview ................................................................. 12
7.2
Feature Description................................................. 12
7.3
Device Functional Modes........................................ 14
8
Applications and Implementation ...................... 16
8.1
Application Information............................................ 16
8.2
Typical Applications ................................................ 16
9
Power Supply Recommendations ...................... 19
10
Layout................................................................... 19
10.1
Layout Guidelines ................................................. 19
10.2
Layout Example .................................................... 19
11
Device and Documentation Support ................. 20
11.1
Community Resource............................................ 20
11.2
Trademarks ........................................................... 20
11.3
Electrostatic Discharge Caution ............................ 20
11.4
Glossary ................................................................ 20
12
Mechanical, Packaging, and Orderable
Information ........................................................... 20
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision H (March 2013) to Revision I
Page
Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section ................................................................................................. 1
Changed 58°C to 42°C in Power Dissipation ....................................................................................................................... 15
Changed 113°C to 59°C in Power Dissipation ..................................................................................................................... 15
Changed 29°C to 21°C in Power Dissipation ....................................................................................................................... 15
Changed 57°C to 30°C in Power Dissipation ....................................................................................................................... 15
Changes from Revision G (March 2013) to Revision H
Page
Changed layout of National Semiconductor Data Sheet to TI format .................................................................................. 16



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