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ABSOLUTE MAXIMUM RATINGS

(1)

DISSIPATION RATINGS

RECOMMENDED OPERATING CONDITIONS

THS7315

SLOS532 – JUNE 2007

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be

more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

PACKAGED DEVICES

PACKAGE TYPE

TRANSPORT MEDIA, QUANTITY

THS7315D

Rails, 75

SOIC-8

THS7315DR

Tape and reel, 2500

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

website at www.ti.com.

Over operating free-air temperature range (unless otherwise noted)

THS7315

UNIT

5.5

V

Input voltage

V

Output current

±90

mA

Continuous power dissipation

See Dissipation Ratings Table

+150

°C

+125

°C

Storage temperature range

–65 to +150

°C

HBM

2000

ESD ratings

CDM

1500

V

MM

200

(1)

Stresses above those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute maximum rated conditions for extended periods may degrade device reliability.

(2)

The absolute maximum junction temperature under any condition is limited by the constraints of the silicon process.

(3)

The absolute maximum junction temperature for continuous operation is limited by the package constraints. Operation above this

temperature may result in reduced reliability and/or lifetime of the device.

PACKAGE

(

°C/W)

(

°C/W)

SOIC-8 (D)

16.8

769 mW

308 mW

(1)

Power rating is determined with a junction temperature of +125

°C. This temperature is the point where performance starts to degrade

and long-term reliability starts to be reduced. Thermal management of the final printed circuit board (PCB) should strive to keep the

junction temperature at or below +125

°C for best performance and reliability.

(2)

This data was taken with the JEDEC High-K test PCB. For the JEDEC low-K test PCB, the

MIN

NOM

MAX

UNIT

Supply voltage

3

5

V

Ambient temperature

–40

+85

°C

2

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