TLK1201IRCPR datasheet(10/25 Pages) TI1

10 / 25 page

TLK1201RCP, TLK1201IRCP

ETHERNET TRANSCEIVERS

SLLS506E − AUGUST 2001 − REVISED MAY 2007

POST OFFICE BOX 655303

• DALLAS, TEXAS 75265

absolute maximum ratings over operating free-air temperature (unless otherwise noted)†

Supply voltage, VDD (see Note 1)

−0.3 V to 3 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Input voltage range at TTL terminals, VI

−0.5 V to 4 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Input voltage range at any other terminal

−0.3 V to VDD +0.3 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Storage temperature, Tstg

−65°C to 150°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Electrostatic discharge

CDM: 1 kV, HBM:2 kV

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Characterized free-air operating temperature range: TLK1201

0°C to 70°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

TLK1201I

−40°C to 85°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . .

† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

NOTE 1: All voltage values, except differential I/O bus voltages, are with respect to network ground terminal.

DISSIPATION RATING TABLE

PACKAGE

TA ≤ 25°C

POWER RATING

OPERATING FACTOR‡

ABOVE TA = 25°C

TA = 70°C

POWER RATING

RCP64§

5.25 W

46.58 mW/°C

2.89 W

RCP64¶

3.17 W

23.70 mW/°C

1.74 W

RCP64#

2.01 W

13.19 mW/°C

1.11 W

‡ This is the inverse of the traditional junction-to-ambient thermal resistance (RθJA).

§ 2 oz. Trace and copper pad with solder

¶ 2 oz. Trace and copper pad without solder

# Standard JEDEC high-K board

NOTE: For more information, see the TI application note PowerPAD Thermally Enhanced

Package, TI literature number SLMA002.

thermal characteristics

PARAMETER

TEST CONDITION

MIN

TYP

MAX

UNIT

Board-mounted, no air flow, high conductivity TI

recommended test board, chip soldered or greased to

thermal land

21.47

RθJA

Junction-to-free-air thermal resistance

Board-mounted, no air flow, high conductivity TI

recommended test board with thermal land but no

solder or grease thermal connection to thermal land

42.2

°C/W

Board-mounted, no air flow, JEDEC test board

75.83

Board-mounted, no air flow, high conductivity TI

recommended test board, chip soldered or greased to

thermal land

0.38

RθJC

Junction-to-case-thermal resistance

Board-mounted, no air flow, high conductivity TI

recommended test board with thermal land but no

solder or grease thermal connection to thermal land

0.38

°C/W

Board-mounted, no air flow, JEDEC test board

7.8

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