THS3095D datasheet(25/31 Pages) TI

25 / 31 page

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DESIGN TOOLS

Evaluation

Fixtures,

Spice

Models,

and

3.5

2.5

1.5

0.5

−40

−20

100

TA − Free-Air Temperature − °C

Results are With No Air Flow and PCB Size = 3”x 3”

θJA = 45.8°C/W for 8-Pin SOIC w/PowerPAD (DDA)

θJA = 58.4°C/W for 8-Pin MSOP w/PowerPAD (DGN)

θJA = 95°C/W for 8-Pin SOIC High−K Test PCB (D)

θJA = 158°C/W for 8-Pin MSOP w/PowerPAD w/o Solder

θJA = 58.4°C/W

θJA = 95°C/W

θJA = 158°C/W

ΤJ = 125°C

θJA = 45.8°C/W

THS3091

THS3095

SLOS423C – SEPTEMBER 2003 – REVISED AUGUST 2004

Application Support

Texas Instruments is committed to providing its

customers with the highest quality of applications

support. To support this goal, an evaluation board

has been developed for the THS3091/5 operational

amplifier. The board is easy to use, allowing for

straightforward evaluation of the device. The evalu-

ation board can be ordered through the Texas

Instruments Web site, www.ti.com, or through your

local Texas Instruments sales representative.

Computer simulation of circuit performance using

SPICE is often useful when analyzing the perform-

ance of analog circuits and systems. This is particu-

larly true for video and RF-amplifier circuits where

parasitic capacitance and inductance can have a

major effect on circuit performance. A SPICE model

for the THS3091/5 is available through the Texas

Instruments Web site (www.ti.com). The Product

Figure 73. Maximum Power Distribution vs

Information Center (PIC) is also available for design

Ambient Temperature

assistance and detailed product information. These

models do a good job of predicting small-signal ac

When determining whether or not the device satisfies

and transient performance under a wide variety of

the maximum power dissipation requirement, it is

operating conditions. They are not intended to model

important to consider not only quiescent power

the distortion characteristics of the amplifier, nor do

dissipation, but also dynamic power dissipation. Often

they attempt to distinguish between the package

times, this is difficult to quantify because the signal

types in their small-signal ac performance. Detailed

pattern is inconsistent, but an estimate of the RMS

information about what is and is not modeled is

power dissipation can provide visibility into a possible

contained in the model file itself.

problem.

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