UCD2003B datasheet(12/24 Pages) TI1

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J(MAX)

(MAX)

OLi

i 1

ULN2003B

SLRS064B – JUNE 2014 – REVISED AUGUST 2016

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Product Folder Links: ULN2003B

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Typical Application (continued)

(1)

These test conditions can not be run simultaneously.

9.2.1 Design Requirements

For this design example, use the parameters listed in Table 1 as the input parameters.

Table 1. Design Parameters

DESIGN PARAMETER (1)

EXAMPLE VALUE

GPIO Voltage

3.3 V or 5 V

Coil Supply Voltage

12 V to 48 V

Number of Channels

Output Current (RCOIL)

20 mA to 300 mA per channel (See Figure 5)

Duty Cycle

See Figure 6 to Figure 14

9.2.2 Detailed Design Procedure

When using ULN2003B in a coil driving application, determine the following:

•

Input Voltage Range

•

Temperature Range

•

Output and Drive Current

•

Power Dissipation

9.2.2.1 Drive Current

The coil current is determined by the coil voltage (VSUP), coil resistance and output low voltage (VOL or

VCE(SAT)).

ICOIL = (VSUP – VCE(SAT)) / RCOIL

(1)

9.2.2.2 Output Low Voltage

The output low voltage (VOL) is the same thing as VCE(SAT) and can be determined by, Figure 1, Figure 2, or

Figure 4.

9.2.2.3 Power Dissipation and Temperature

The number of coils driven is dependent on the coil current and on-chip power dissipation. The number of coils

driven can be determined by Figure 6 or Figure 7.

For a more accurate determination of number of coils possible, use Equation 2 to calculate ULN2003B on-chip

power dissipation PD:

where

•

N is the number of channels active together.

•

VOLi is the OUTi pin voltage for the load current ILi. This is the same as VCE(SAT)

(2)

In order to guarantee reliability of ULN2003B and the system the on-chip power dissipation must be lower that or

equal to the maximum allowable power dissipation (PD(MAX)) dictated by Equation 3.

where

•

TJ(MAX) is the target maximum junction temperature.

•

TA is the operating ambient temperature.

•

θJA is the package junction to ambient thermal resistance.

(3)

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