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LMH6533SP Datasheet(PDF) 4 Page - National Semiconductor (TI) |
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LMH6533SP Datasheet(HTML) 4 Page - National Semiconductor (TI) |
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4 / 11 page ![]() Note 10: This figure is taken from a thermal modeling result. The test board is a 4 layer FR-4 board measuring 101 mm x 101 mm x 1.6 mm witha3x3 array of thermal vias. The ground plane on the board is 50 mm x 50 mm. Ambient temperature in simulation is 22˚C, still air. Power dissipation is 1W. Note 11: Reference IEEE Reduced Range Link (RRL) specifications. Note 12: Positive current corresponds to current flowing into the device. Note 13: Input currents are set to 0.3 mA Note 14: Total input current is 4.4 mA (all 4 channels equal) and output currents are summed together (see typical performance characteristics). Connection Diagram 28-Pin LLP 20027702 Top View Ordering Information Package Part Number Package Marking Transport Media NSC Drawing 28-Pin LLP LMH6533SP NOPB LMH6533SP 1k Units Tape and Reel SPA28A LMH6533SPX NOPB 4.5k Units Tape and Reel www.national.com 4 |
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