Thermal Impedance

Package

Test PCB

Substrate

θ JA (C°/W)

Airflow = 0 m/s

θ JA (C°/W)

Airflow = 1 m/s

θ JA (C°/W)

Airflow = 2 m/s

θ JB (C°/W)

θ JC (C°/W)

165 BGA

4-layer

19.0

16.3

15.3

7.7

2.5

Notes:

1. Thermal Impedance data is based on a number of of samples from mulitple lots and should be viewed as a typical number.

2. Please refer to JEDEC standard JESD51-6.

3. The characteristics of the test fixture PCB influence reported thermal characteristics of the device. Be advised that a good thermal path to

the PCB can result in cooling or heating of the RAM depending on PCB temperature.

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

Rev: 1.02a 11/2012

13/30

© 2011, GSI Technology

GS8342D06/11/20/38BD-550/500/450/400/350

HSTL I/O DC Input Characteristics

Parameter

Symbol

Min

Max

Units

Notes

Input Reference Voltage

V

—

Input High Voltage

V

1

Input Low Voltage

–0.3

V

1

Input High Voltage

V

2,3

Input Low Voltage

–0.3

V

2,3

Notes:

1. Parameters apply to K, K, SA, D, R, W, BW during normal operation and JTAG boundary scan testing.

2. Parameters apply to Doff, ODT during normal operation and JTAG boundary scan testing.

3. Parameters apply to ZQ during JTAG boundary scan testing only.

HSTL I/O AC Input Characteristics

Parameter

Symbol

Min

Max

Units

Notes

Input Reference Voltage

V

—

Input High Voltage

V

1,2,3

Input Low Voltage

–0.5

V

1,2,3

Input High Voltage

V

4,5

Input Low Voltage

–0.5

0.2

V

4,5

Notes:

2. Input rise and fall times must be a minimum of 1 V/ns, and within 10% of each other.

3. Parameters apply to K, K, SA, D, R, W, BW during normal operation and JTAG boundary scan testing.

4. Parameters apply to Doff, ODT during normal operation and JTAG boundary scan testing.

5. Parameters apply to ZQ during JTAG boundary scan testing only.