DS1646/DS1646P

10 of 11

DS1646 32-PIN PACKAGE

PKG

28-PIN

DIM

MIN

MAX

A IN.

MM

1.670

38.42

1.690

38.93

B IN.

MM

0.715

18.16

0.740

18.80

C IN.

MM

0.335

8.51

0.365

9.27

D IN.

MM

0.075

1.91

0.105

2.67

E IN.

MM

0.015

0.38

0.030

0.76

F IN.

MM

0.140

3.56

0.180

4.57

G IN.

MM

0.090

2.29

0.110

2.79

H IN.

MM

0.590

14.99

0.630

16.00

J IN.

MM

0.010

0.25

0.018

0.45

K IN.

MM

0.015

0.38

0.025

0.64

DS1646P

PKG

INCHES

DIM

MIN

NOM

MAX

A

0.920

0.925

0.930

B

0.980

0.985

0.990

C

-

-

0.080

D

0.052

0.055

0.058

E

0.048

0.050

0.052

F

0.015

0.020

0.025

G

0.025

0.027

0.030

NOTE:

For the PowerCap version:

a.

Dallas Semiconductor recommends that PowerCap Module bases experience one pass through solder

reflow oriented with the label side up (“live - bug”).

b. Hand Soldering and touch-up: Do not touch or apply the soldering iron to leads for more than

3 (three) seconds. To solder, apply flux to the pad, heat the lead frame pad and apply solder. To

remove the part, apply flux, heat the lead frame pad until the solder reflows and use a solder wick to

remove solder.