iW3602

AC/DC Digital Power Controller for

Dimmable LED Drivers

Rev. 1.0

iW3602

© 2015 Dialog Semiconductor (UK) Ltd.

Datasheet

18 of 19

Compliant to JEDEC Standard MS12F

Controlling dimensions are in inches; millimeter dimensions are for reference only

This product is RoHS compliant and Halide free.

Soldering Temperature Resistance:

[a] Package is IPC/JEDEC Std 020D Moisture Sensitivity Level 1

[b] Package exceeds JEDEC Std No. 22-A111 for Solder Immersion Resistance; package can withstand

10 s immersion < 260˚C

Dimension D does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall

not exceed 0.15 mm per end. Dimension E does not include interlead flash or protrusion. Interlead flash or

protrusion shall not exceed 0.25 mm per side.

The package top may be smaller than the package bottom. Dimensions D and E are determined at the

outermost extremes of the plastic body exclusive of mold flash, tie bar burrs, gate burrs and interlead flash, but

including any mismatch between the top and bottom of the plastic body.

8-Lead Small Outline (SOIC) Package

COPLANARITY

0.10 (0.004)

8

5

4

1

SEATING

PLANE

A1

E

H

B

D

e

A

C

L

α

TOP VIEW

SIDE VIEWS

Inches

Millimeters

MIN

0.0020

A1

MAX

MIN

MAX

0.0060

0.05

0.150

0.051

A

0.067

1.30

1.70

0.014

B

0.019

0.36

0.48

0.007

C

0.010

0.18

0.25

0.189

D

0.197

4.80

5.00

0.150

E

0.157

3.81

3.99

0.050 BSC

e

1.27 BSC

0.228

H

0.244

5.79

6.20

0.086

N

0.094

2.18

2.39

0.016

L

0.050

0.41

1.27

0°

α

8°

M

3.20

3.00

0.118

0.126

Part Number

Options

Package

Description

iW3602-01

iW3602-03

Supports high power factor (> 0.9 without dimmer)

iW3602-31

Low Cost Package

SOIC-8

Note 1: Tape & Reel packing quantity is 2,500/reel. Minimum ordering quantity is 2,500.

Note 2: Refer to Section 9.4 Chopping Operation for more information.

Note 3: For the exposed pad package, refer to Section 9.13 Thermal Design.

13.0 Ordering Information