LMV321 datasheet(18/20 Pages) ONSEMI

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LMV321, LMV358, LMV324

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PACKAGE DIMENSIONS

SOIC−14 NB

CASE 751A−03

ISSUE K

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE PROTRUSION

SHALL BE 0.13 TOTAL IN EXCESS OF AT

MAXIMUM MATERIAL CONDITION.

4. DIMENSIONS D AND E DO NOT INCLUDE

MOLD PROTRUSIONS.

5. MAXIMUM MOLD PROTRUSION 0.15 PER

SIDE.

0.25

B M

X 45

SEATING

PLANE

0.25

B S

13X

DETAIL A

DIM

MIN

MAX

MIN

MAX

INCHES

MILLIMETERS

8.55

8.75

0.337

0.344

3.80

4.00

0.150

0.157

1.35

1.75

0.054

0.068

0.35

0.49

0.014

0.019

0.40

1.25

0.016

0.049

1.27 BSC

0.050 BSC

0.19

0.25

0.008

0.010

0.10

0.25

0.004

0.010

5.80

6.20

0.228

0.244

0.25

0.50

0.010

0.019

6.50

14X

0.58

14X

1.18

1.27

DIMENSIONS: MILLIMETERS

PITCH

SOLDERING FOOTPRINT*

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

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