www.ti.com

PACKAGE OUTLINE

C

TYP

-.244

.228

-6.19

5.80

[

]

.069 MAX

[1.75]

14X .0250

[0.635]

16X

-.012

.008

-0.30

0.21

[

]

2X

.175

[4.45]

TYP

-.010

.005

-0.25

0.13

[

]

0 - 8

-.010

.004

-0.25

0.11

[

]

(.041 )

[1.04]

.010

[0.25]

GAGE PLANE

-.035

.016

-0.88

0.41

[

]

A

NOTE 3

-.197

.189

-5.00

4.81

[

]

B

NOTE 4

-.157

.150

-3.98

3.81

[

]

SHRINK SMALL-OUTLINE PACKAGE

SSOP - 1.75 mm max height

DBQ0016A

4214846/A 03/2014

NOTES:

1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches.

Dimensioning and tolerancing per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not

exceed .006 inch, per side.

4. This dimension does not include interlead flash.

5. Reference JEDEC registration MO-137, variation AB.

1

16

.007 [0.17]

C A

B

9

8

PIN 1 ID AREA

SEATING PLANE

.004 [0.1] C

SEE DETAIL A

TYPICAL

DETAIL A

SCALE 2.800

30

ISO7730, ISO7731

SLLSES0B – SEPTEMBER 2016 – REVISED OCTOBER 2016

www.ti.com

Product Folder Links: ISO7730 ISO7731

Submit Documentation Feedback

Copyright © 2016, Texas Instruments Incorporated