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© Koninklijke Philips Electronics N.V. 2004. All rights reserved.

Preliminary data sheet

Rev. 01 — 19 July 2004

18 of 24

Philips Semiconductors

SA56202

One-chip motor driver

12. Package outline

Fig 14. Package outline.

UNIT

A

max.

ce

y

w

v

θ

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

mm

1.2

0.15

0.05

1.05

0.80

0.25

0.27

0.17

0.20

0.09

4.3

4.1

0.5

8.3

7.9

0.4

0.1

8

0

o

o

0.08

0.1

0.2

1

DIMENSIONS (mm are the original dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

0.8

0.4

SOT793-1

143E36T

MO-153

03-03-04

14.1

13.9

6.2

6.0

4.3

4.1

Eh

Dh

HE

D

E

c

X

θ

A

Lp

detail X

L

(A3)

A2

A1

y

exposed die pad

pin 1 index

bp

HTSSOP56: plastic thermal enhanced thin shrink small outline package; 56 leads;

body width 6.1 mm; exposed die pad

SOT793-1

e

A

Z

1

56

28

29

0

2.5

5 mm

scale