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MD2131 Datasheet(PDF) 7 Page - Supertex, Inc

Part # MD2131
Description  High Speed Ultrasound Beamforming Source Driver
PDF  8 Pages
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Manufacturer  SUTEX [Supertex, Inc]
Direct Link  http://www.supertex.com
Logo SUTEX - Supertex, Inc

MD2131 Datasheet(HTML) 7 Page - Supertex, Inc

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MD2131
Supertex inc.
www.supertex.com
Doc.# DSFP-MD2131
C102412
Pin Description
Pin #
Function
Description
1
KA
Kelvin connection A
2
GND
High current output ground
3
C1A
Bypass cap KA, 10nF low ESR X7R ceramic cap
4
GND
High current output ground
5
VDD
Supplies voltage of the gate driver and internal analog circuit
6
C3A
Bypass cap to GND of Pin#7, 10nF low ESR X7R ceramic cap
7
GND
High current output ground
8
VLL
Supply voltage of logic circuit
9
DGND
Digital logic ground
10
SCK
Serial clock input
11
SDI
Serial data input
12
QA
PWM control logic input of quadrature-phase A
13
QB
PWM control logic input of quadrature-phase B
14
IA
PWM control logic input of in-phase A
15
IB
PWM control logic input of in-phase B
16
VDD
Supplies voltage of the gate driver and internal analog circuit
17
AGND
Analog reference ground
18
SDO
Serial data output, updated at SCK falling edge
19
CS
Serial chip select, active low, and buffer register loading clock on rising edge
20
LD
DAC data register loading clock on rising edge
21
EN
Enable, EN = Low, PA = PB = Hi-Z
22
VREF
External reference voltage input
23
RFB
Resistor to GND, 50kΩ 0.1% for the best accuracy
24
GND
High current output ground
25
C3B
Bypass cap to GND of Pin#24, 10nF low ESR X7R ceramic cap
26
VDD
Supplies voltage of the gate driver and internal analog circuit
27
GND
High current output ground
28
C1B
Bypass cap to KB, 10nF low ESR X7R ceramic cap
29
GND
High current output ground
30
KB
Kelvin connection B
31
C2B
Bypass cap to KB, 10nF low ESR X7R ceramic cap
32
PB
Current sinking source driver output B, external Schottky diode to VDD
33
PB
Current sinking source driver output B, external Schottky diode to VDD
34
PB
Current sinking source driver output B, external Schottky diode to VDD
35
VSUB
Substrate voltage must connected to the lowest potential of the IC, the ground
36
37
PA
Current sinking source driver output A, external Schottky diode to VDD
38
PA
Current sinking source driver output A, external Schottky diode to VDD
39
PA
Current sinking source driver output A, external Schottky diode to VDD
40
C2A
Bypass Cap to KA, 10nF low ESR X7R ceramic cap
Notes:
1.
Pins #35 & #36 are VSUB connected to the center thermal pad internally in the package.
2.
All bypass capacitors need be very close to the pins



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