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OMAP5910 Datasheet(PDF) 21 Page - Texas Instruments

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Part # OMAP5910
Description  DUAL-CORE PROCESSOR
PDF  166 Pages
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

OMAP5910 Datasheet(HTML) 21 Page - Texas Instruments

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Introduction
21
August 2002 − Revised August 2004
SPRS197D
Table 2−1. GZG BGA Terminal Assignments (Continued)
GZG
BGA
BALL #
SIGNAL
GZG
BGA
BALL #
SIGNAL
GZG
BGA
BALL #
SIGNAL
GZG
BGA
BALL #
SIGNAL
Y18
TRST
Y19
TDI
Y20
CVDD
Y21
CVDDA
AA1
VSS
AA2
DVDD2
AA3
CVDD2
AA5
MCBSP2.DX/
MCBSP2.DR
AA7
VSS
AA9
MCSI2.DIN/
USB2.VP
AA11
DVDD1
AA13
MCSI1.CLK/
USB1.VM
AA15
UART1.RTS
AA17
MPU_BOOT/
MCBSP3.DR/
USB1.SUSP
AA19
TDO
AA20
CLK32K_CTRL
AA21
VSS
† See Section 5.6.1 and Section 5.6.2 for special VSS considerations with ocillator circuits.
Figure 2−2 illustrates the ball locations for the 289-ball GDY ball grid array (BGA) package and is used in
conjunction with Table 2−1 to locate signal names and ball grid numbers. GDY BGA ball numbers in
Figure 2−2 are read from left-to-right, top-to-bottom.
A
1
2
B
4
3
6
5
8
7
10
9
12
11
14
13
16
15
17
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
Bottom View
Figure 2−2. OMAP5910 GDY Package (Bottom View)
In Table 2−2, signals with multiplexed functions are separated with forward slashes as follows:
•
signal1/signal2/signal3 (for example, GPIO11/HDQ)
Signals which are associated with specific peripherals are denoted by using the peripheral name, followed
by a period, and then the signal name; as follows:
•
peripheral1.signal1 (for example, MCBSP1.DR)



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