MAX14131 datasheet(2/25 Pages) MAXIM

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VDDA to GNDA, VDDB to GNDB.............................-0.3V to +6V

INA_, ENA to GNDA................................................-0.3V to +6V

INB_, ENB to GNDB ...............................................-0.3V to +6V

OUTA_ to GNDA .................................... -0.3V to (VDDA + 0.3V)

OUTB_ to GNDB.................................... -0.3V to (VDDB + 0.3V)

Short-Circuit Duration

(OUTA_ to GNDA, OUTB_ to GNDB) ..................Continuous

Continuous Power Dissipation (TA = +70°C)

Wide SOIC (derate 14.1mW/°C above +70°C) ......1126.8mW

Narrow SOIC (derate 13.3mW/°C above +70°C) ..1066.7mW

QSOP (derate 9.6mW/°C above +70°C)..................771.5mW

Operating Temperature Range......................... -40°C to +125°C

Maximum Junction Temperature .....................................+150°C

Storage Temperature Range............................ -65°C to +150°C

Lead Temperature (soldering, 10s) .................................+300°C

Soldering Temperature (reflow) ......................................+260°C

Wide SOIC

Junction-to-Ambient Thermal Resistance (θJA) ..........71°C/W

Junction-to-Case Thermal Resistance (θJC)...............23°C/W

QSOP

Junction-to-Ambient Thermal Resistance (θJA) .....103.7°C/W

Junction-to-Case Thermal Resistance (θJC)...............37°C/W

Narrow SOIC

Junction-to-Ambient Thermal Resistance (θJA) ..........75°C/W

Junction-to-Case Thermal Resistance (θJC)...............24°C/W

(Note 1)

(VDDA - VGNDA = +1.71V to +5.5V, VDDB - VGNDB = +1.71V to +5.5V, CL = 15pF, TA = -40°C to +125°C, unless otherwise noted.

Typical values are at VDDA - VGNDA = +3.3V, VDDB - VGNDB = +3.3V, VGNDA = VGNDB, TA = +25°C, unless otherwise noted.) (Note 2)

MAX14930–MAX14932,

MAX14130–MAX14131

4-Channel, 1kVRMS, 2.75kVRMS

and 3.75kVRMS Digital Isolators

www.maximintegrated.com

Maxim Integrated │ 2

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

POWER SUPPLY

Operating Supply Voltage

VDDA

Relative to GNDA

1.71

5.5

VDDB

Relative to GNDB

1.71

5.5

Undervoltage Lockout Threshold

VUVLO_

VDD_ rising

1.45

1.58

1.71

Undervoltage Lockout Threshold

Hysteresis

VUVLO_

HYST

DC Electrical Characteristics

Absolute Maximum Ratings

Package Thermal Characteristics

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer

board. For detailed information on package thermal considerations, refer to

www.maximintegrated.com/thermal-tutorial.

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these

or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect

device reliability.

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