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LSM6DS3USTR Datasheet(PDF) 1 Page - STMicroelectronics |
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LSM6DS3USTR Datasheet(HTML) 1 Page - STMicroelectronics |
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1 / 104 page  This is information on a product in full production. April 2016 DocID028476 Rev 4 1/104 LSM6DS3US iNEMO inertial module: always-on 3D accelerometer and 3D gyroscope Datasheet - production data Features Power consumption: 0.85 mA in combo normal mode and 1.1 mA in combo high-performance mode up to 1.6 kHz. “Always-on” experience with low power consumption for both accelerometer and gyroscope Interface flexibility: selectable SPI (3/4-wire) or I2C with the main processor Auxiliary SPI (3-wire) to support OIS applications EIS/OIS support Accelerometer ODR up to 6.66 kHz Gyroscope ODR up to 3.33 kHz Smart FIFO ±2/±4/±8/±16 g full scale ±125/±245/±500/±1000/±2000 dps full scale Analog supply voltage: 1.71 V to 3.6 V Independent IOs supply (1.62 V) Compact footprint, 2.5 mm x 3 mm x 0.83 mm SPI/I2C serial interface data synchronization feature Embedded temperature sensor ECOPACK®, RoHS and “Green” compliant Applications EIS and OIS for camera applications Collecting sensor data Motion tracking and gesture detection Pedometer, step detector and step counter Significant motion and tilt functions Indoor navigation IoT and connected devices Vibration monitoring and compensation Description The LSM6DS3US is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope performing at 1.1 mA (up to 1.6 kHz ODR) in high- performance mode and enabling always-on low-power features for an optimal motion experience for the consumer. The LSM6DS3US supports main OS requirements, offering real, virtual and batch sensors with 4 kbyte FIFO + flexible 4 kbyte (FIFO or programmable) for dynamic data batching. The LSM6DS3US gyroscope supports both OIS/EIS applications. The device can be connected to the camera module through a dedicated auxiliary SPI (Mode 3) while flexibility for the primary interface is available (I2C/SPI). ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes. The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element. The LSM6DS3US has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of ±125/±245/±500/±1000/±2000 dps. High robustness to mechanical shock makes the LSM6DS3US the preferred choice of system designers for the creation and manufacturing of reliable products. The LSM6DS3US is available in a plastic land grid array (LGA) package. LGA-14L (2.5 x 3 x 0.83 mm) typ. Table 1. Device summary Part number Temp. range [°C] Package Packing LSM6DS3USTR -40 to +85 LGA-14L (2.5 x 3 x 0.83 mm) Tape & Reel www.st.com |
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