MS5535C

14 bar Pressure Sensor Module

09/2015

Page 21

ASSEMBLY

MECHANICAL STRESS

It is recommended to avoid mechanical stress on the PCB on which the sensor is mounted. The thickness of the

PCB should not be below 1.6 mm. A thicker PCB is stiffer creating less stress on the soldering contacts. For

applications where mechanical stress cannot be avoided (for example ultrasound welding of the case or thin PCB’s

in watches) please fix the sensor with drops of low stress epoxy (for example Hysol FP-4401) at the corners of the

sensor as shown below.

Fixing with Globtop

increases mechanical

stability

MOUNTING

The MS5535C can be placed with automatic Pick&Place equipment using vacuum nozzles. It will not be damaged

by the vacuum. Due to the low stress assembly the sensor does not show pressure hysteresis effects.

Special care has to be taken to not touch the protective gel of the sensor during the assembly.

The MS5535C can be mounted with the cap down or the cap looking upwards. In both cases it is important to solder

PV to GND!

Placement cap down

(hole in PCB to fit cap)

Solder at both sides to

increase mechanical

stability

Placement cap up

SEALING WITH O-RING

In products like outdoor watches the electronics must be protected against direct water or humidity. For those

products the MS5535-CM provides the possibility to seal with an O-ring. The protective cap of the MS5535CM is

made of special anticorrosive stainless steel with a polished surface. In addition to this the MS5535CM is filled with

silicone gel covering the sensor and the bonding wires. The O-ring (or O-rings) shall be placed at the outer diameter

of the metal cap. This method avoids mechanical stress because the sensor can move in vertical direction.