5

5 - 11

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order On-line at www.hittite.com

Outline Drawing

NOTES:

1. ALL DIMENSIONS ARE IN INCHES [MM].

2. TYPICAL BOND PAD IS .004” SQUARE.

3. BOND PAD SPACING IS .006” CENTER TO CENTER.

4. BACKSIDE METALIZATION: GOLD.

5. BACKSIDE METAL IS GROUND.

6. BOND PAD METALIZATION: GOLD.

7. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS.

Standard

Alternate [2]

WP-2 (Waffle Pack)

[2]

[1] Refer to the “Packaging Information” section for die

packaging dimensions.

[2] Reference this suffix only when ordering alternate die

packaging.

ELECTROSTATIC SENSITIVE DEVICE

OBSERVE HANDLING PRECAUTIONS

HMC136

v03.0909

GaAs MMIC BI-PHASE

MODULATOR, 4 - 8 GHz