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HMC232 Datasheet(PDF) 6 Page - Micross Components

Part # HMC232
Description  Assembly Assistance
PDF  9 Pages
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Manufacturer  MICROSS [Micross Components]
Direct Link  http://www.micross.com
Logo MICROSS - Micross Components

HMC232 Datasheet(HTML) 6 Page - Micross Components

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For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
Truth Table
Absolute Maximum Ratings
Control Voltages
Outline Drawing
Control Input
Signal Path State
A
B
RFC to RF1
RFC to RF2
High
Low
ON
OFF
Low
High
OFF
ON
State
Bias Condition
Low
0 to -0.2V @ 10 uA Max.
High
-5V @ 10 uA Typ. to -7V @ 45 uA Typ.
RF Input Power (Vctl = -5V)
(0.5 - 15 GHz)
+30 dBm (@ +50 °C)
Control Voltage Range (A & B)
+1 V to -7.5 Vdc
Channel Temperature
150 °C
Thermal Resistance
92 °C/W
Storage Temperature
-65 to +150 °C
Operating Temperature
-55 to +85 °C
ESD Sensitivity (HBM)
Class 1A
NOTES:
1. ALL DIMENSIONS IN INCHES [MILLIMETERS]
2. BOND PADS ARE 0.004” SQUARE
3. TYPICAL BOND PAD SPACING CENTER TO CENTER IS .006”
4. BACKSIDE METALIZATION: GOLD
5. BOND PAD METALIZATION: GOLD
6. BACKSIDE OF DIE IS GROUND
7. DIE THICKNESS IS .004”
8. NO CONNECTION REQUIRED FOR UNLABLED BOND PADS
Caution: Do not “Hot Switch” power levels greater than +26 dBm
(Vctl = 0/-5 Vdc).
Die Packaging Information [1]
Standard
Alternate
WP-17 (Waffle Pack)
[2]
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
HMC232
v03.0907
GaAs MMIC SPDT NON-REFLECTIVE
SWITCH, DC - 15 GHz



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