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For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order On-line at www.hittite.com

Outline Drawing

NOTES:

1. DIMENSIONS IN INCHES [MILLIMETERS].

2. DIE THICKNESS IS 0.004”.

3. TYPICAL BOND PAD IS 0.004” SQUARE.

4. TYPICAL BOND PAD SPACING IS 0.006” CENTER TO CENTER.

5. BOND PAD METALLIZATION: GOLD.

6. BACKSIDE METALLIZATION: GOLD.

7. BACKSIDE METAL IS GROUND.

8. NO CONNECTION REQUIRED FOR UNLABELED BOND PADS.

Standard

Alternate

WP-2 (Waffle Pack)

[2]

[1] Refer to the “Packaging Information” section for die

packaging dimensions.

[2] For alternate packaging information contact Hittite

Microwave Corporation.

HMC344

v06.0709

GaAs MMIC SP4T NON-REFLECTIVE

SWITCH, DC - 8 GHz