For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824

Phone: 978-250-3343

Fax: 978-250-3373

Order On-line at www.hittite.com

Application Support: Phone: 978-250-3343 or apps@hittite.com

5

HMC441

v07.0913

GaAs pHEMT MMIC MEDIUM

POWER AMPLIFIER, 6 - 18 GHz

Outline Drawing

NOTES:

1. ALL DIMENSIONS ARE IN INCHES [MM]

2. DIE THICKNESS IS .004”

3. TYPICAL BOND IS .004” SQUARE

4. BACKSIDE METALLIZATION: GOLD

5. BOND PAD METALLIZATION: GOLD

6. BACKSIDE METAL IS GROUND.

7. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS.

Standard

Alternate

GP-2 (Gel Pack)

[2]

[1] Refer to the “Packaging Information” section for die

packaging dimensions.

[2] For alternate packaging information contact Hittite

Microwave Corporation.

Pad Descriptions

Pad Number

Function

Description

Pin Schematic

1

RFIN

This pad is AC coupled

and matched to 50 Ohms.

2, 3

Vdd1, Vdd2

Power Supply Voltage for the amplifier. An external

bypass capacitor of 100 pF is required.

4

RFOUT

This pad is AC coupled

and matched to 50 Ohms.

5, 6

Vgg1, Vgg2

Optional gate control for amplifier. If left open, the

amplifier will run at standard current. Negative voltage

applied will reduce current.