2

2 - 29

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order On-line at www.hittite.com

Absolute Maximum Ratings

Outline Drawing

RF Input (Vcc= +5V)

+20 dBm

Supply Voltage (Vd1, Vd2)

+6.0 Vdc

Channel Temperature

175 °C

Continuous Pdiss (T= 85 °C)

(derate 7.1 mW/°C above 85 °C)

0.64 W

Thermal Resistance

(junction to die bottom)

141.7 °C/W

Storage Temperature

-65 to +150 °C

Operating Temperature

-55 to +85 °C

NOTES:

1. ALL DIMENSIONS ARE IN INCHES [MILLIMETERS].

2. DIE THICKNESS IS .004”

3. TYPICAL BOND PAD IS .004” SQUARE.

4. TYPICAL BOND SPACING IS .006” CENTER TO CENTER.

5. BOND PAD METALIZATION: GOLD

6. BACKSIDE METALIZATION: GOLD

7. BACKSIDE METAL IS GROUND.

8. NO CONNECTION REQUIRED FOR UNLABELED BOND PADS.

Typical Supply Current vs. Vdd

Vdd (V)

Idd (mA)

4.5

47

5.0

48

5.5

49

Note:

Multiplier will operate over full voltage range shown above.

ELECTROSTATIC SENSITIVE DEVICE

OBSERVE HANDLING PRECAUTIONS

Standard

Alternate [2]

GP-2 (Gel Pack)

—

[1] Refer to the “Packaging Information” section for die

packaging dimensions.

[2] Reference this suffix only when ordering alternate die

packaging.

HMC448

v01.1007

GaAs MMIC x2 ACTIVE FREQUENCY

MULTIPLIER, 19 - 25 GHz OUTPUT