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SST38VF6402 Datasheet(PDF) 62 Page - Microchip Technology |
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SST38VF6402 Datasheet(HTML) 62 Page - Microchip Technology |
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62 / 64 page  ©2015 DS-20005015B 08/15 62 64 Mbit (x16) Advanced Multi-Purpose Flash Plus SST38VF6401 / SST38VF6402 / SST38VF6403 / SST38VF6404 Not Recommended for New Designs Packaging Diagrams Figure 36:48-lead Thin Small Outline Package (TSOP) 12mm x 20mm Package Code: EKE For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: Microchip Technology Drawing C04-14036A Sheet 1 of 1 48-Lead Thin Small Outline Package (EKE/F) - [TSOP] 48-tsop-EK-8 Note: 1. Complies with JE DEC publication 95 MO-142 DD dimensions, although some dimensions may be more stringent. 2. All linear dimensions are in millimeters (max/min). 3. Coplanarity: 0.1 mm 4. Maximum allowable mold flash is 0.15 mm at the package ends, and 0.25 mm between leads. |
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