Data Sheet

ADV7613

Rev. A | Page 7 of 13

ABSOLUTE MAXIMUM RATINGS

Table 4.

Parameter

Rating

DVDD to GND

2.2 V

PVDD to GND

2.2 V

DVDDIO to GND

4.0 V

CVDD to GND

2.2 V

TVDD to GND

4.0 V

LTX_VDD to GND

2.2 V

Digital Inputs to GND

GND − 0.3 V to DVDDIO + 0.3 V

5 V Tolerant Digital Inputs to

5.3 V

Digital Outputs to GND

GND − 0.3 V to DVDDIO + 0.3 V

XTALP, XTALN

−0.3 V to PVDD + 0.3 V

SCL, SDA Data Pins to

DVDDIO

DVDDIO − 0.3 V to DVDDIO + 3.6 V

Maximum Junction

Temperature (T

125°C

Storage Temperature Range

−60°C to +150°C

Infrared Reflow Soldering

(20 sec)

260°C

Operating Temperature

Range

−40°C to +85°C

DDCA_SDA.

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

To reduce power consumption when using the ADV7613, turn

off the unused sections of the device.

Due to printed circuit board (PCB) metal variation and,

may differ for various PCBs.

It is possible to obtain the most efficient measurement solution

by using the package surface temperature to estimate the die

temperature because this solution eliminates the variance

When using the device, the maximum junction temperature

calculates the junction temperature using the measured package

surface temperature and applies only when no heat sink is used

on the device under test (DUT):

where:

board defined in the JEDEC specification).

where 0.2 is 20% of the TVDD power that is dissipated on the

device itself.

ESD CAUTION