6 − 107

Small Outline SO-8 Package

Solder Reflow Temperature Profile

(Surface Mount Option Parts)

Regulatory Information

The HCPL-260L/060L/263L/063L

are pending by the following

organizations:

UL

Approval (pending) under UL

1577, Component Recognition

Program, File E55361.

CSA

Approval (pending) under CSA

Component Acceptance Notice

#5, File CA 88324.

VDE

Approval (pending) according to

VDE 0884/06.92.

XXX

YWW

8765

4

3

2

5.994

± 0.203

(0.236

± 0.008)

3.937

± 0.127

(0.155

± 0.005)

0.406

± 0.076

(0.016

± 0.003)

1.270

(0.050)

BSG

5.080

± 0.127

(0.200

± 0.005)

3.175

± 0.127

(0.125

± 0.005)

1.524

(0.060)

45

° X

0.432

(0.017)

0.228

± 0.025

(0.009

± 0.001)

TYPE NUMBER

(LAST 3 DIGITS)

DATE CODE

0.305

(0.012)

MIN.

TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH)

5.207

± 0.254 (0.205 ± 0.010)

DIMENSIONS IN MILLIMETERS (INCHES).

LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX.

0.203

± 0.102

(0.008

± 0.004)

7

°

PIN ONE

0 ~ 7

°

*

*

240

∆T = 115°C, 0.3°C/SEC

0

∆T = 100°C, 1.5°C/SEC

∆T = 145°C, 1°C/SEC

TIME – MINUTES

220

200

180

160

140

120

100

80

60

40

20

0

260

12

3

456789

10

11

12

NOTE: USE OF NON-CHLORINE ACTIVATED FLUXES IS HIGHLY RECOMMENDED.

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