6

BOperating Precautions

1. Recommended Temperature Profile

(Lead-free soldering possible)

2. Recommended Hand Solder Conditions

Soldering iron temperature : 350 ± 10

℃, soldering time : within 3 seconds

3. Recommended Screen Thickness, Aperture

Opening Rate (Pattern Area Ratio)

Thickness 0.1mm, aperture opening rate : 100%

4. PCB Warpage

Max 0.02mm at the center of connector with the both edges of the connector

as the baseline.

5. Cleaning Condition

Cleaning with IPA is possible. (Cleaning is not recommended as it may

change the feel of insertion/extraction, etc. Please consult with us when

using other types of cleaning agents.)

6. Precautions

■ Insertion/extraction of the connector while not mounted to the PCB may

cause breakage or deformation to the contact.

■ Do not apply flux at the time of hand soldering, as it may result in flux rise.

■ This product may have slightly different hue on molded items, however,

they do not affect the product performance.

■ See the separate “DF58 Insertion/Extraction Procedure Manual” for

handling precautions at the time of insertion and extraction.

[Applicable Conditions]

1. Peak Temperature : MAX 250

℃

2. Heated Area : 220

℃ or above, within 60 sec.

3. Pre-heating Area : 150-180

℃, 90-120 sec.

4. Number of Operation : Twice or less

* The contact lead area was measured.

The conditions may change depending on the types and manufacturers of

cream solder, PCB size, and conditions of other materials used for

soldering. Please fully check the soldering condition before use.

[Remarks 1] This temperature profile is our recommended value.

50

60sec

100

150

200

250

0

PRE-HEATING TIME SOLDERING TIME

TIME（sec）

90‒120sec

180ç

220ç

10sec MAX

MAX 250