Nichrome Resistor Networks

on Silicon Substrates

SS103VD and SFN06VD series

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General Note

TT electronics reserves the right to make changes in product specification without notice or liability.

All information is subject to TT electronics’ own data and is considered accurate at time of going to print.

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10.13

Environmental (Mil-R-83401)

Power Derating Curve

Mechanical

Thermal Shock plus Power Conditioning

ΔR 0.25%

Short Time Overload

ΔR 0.1%

Moisture Resistance

ΔR 0.2%

Mechanical Shock

ΔR 0.25%

Vibration

ΔR 0.25%

Low Temperature Operation

ΔR 0.1%

High Temperature Exposure

ΔR 0.1%

Resistance to Solder Heat

ΔR 0.05%

Marking Permanency

Per MIL-STD-202, Method 215

Storage Temperature Range

-55°C to +125°C

Lead Plating

100 matte Tin (RoHS)

Lead Material

Copper Alloy

Lead Configurations (SLP/SS1)

No lead, Gull Wing

Lead Coplanarity (SS1 only)

0.003” (0.102 mm)

Substrate Material

Silicon

Resistor Material

Passivated Nichrome

Body Material

Molded Epoxy

Package Types

6 pad SON 2mm square, 3 lead SOT23

Temperature Coefficient of Resistance (TCR)

TCR Code (-55°C to 125°C)

Q

P

S

L

Absolute (ppm/°C)

± 25

± 50

± 100

± 200

Tracking (R1 Ref) (ppm/°C)

± 5

± 5

N/A

N/A

OBSOLETE