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TAS5110DAD Datasheet(PDF) 11 Page - Texas Instruments

Part # TAS5110DAD
Description  TRUE DIGITAL AUDIO AMPLIFIER TAS5110 PWM POWER OUTPUT STAGE
PDF  20 Pages
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

TAS5110DAD Datasheet(HTML) 11 Page - Texas Instruments

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TAS5110
SLES028A – MAY 2002 – REVISED SEPTEMBER 2002
11
www.ti.com
recommended operating conditions (maximum output power = 50 W (RMS), TJ = 25°C)
thermal data
PARAMETER
MIN
NOM
MAX
UNIT
Shutdown junction temperature, TJ(SD)
150
°C
Warning junction temperature, TJ(W)
125
°C
Operating temperature TC
Commercial
0
25
70
°C
Operating temperature, TC
Industrial
–40
25
85
°C
Thermal resistance junction-to-case,
θjc}
2 oz trace and copper pad without solder
1.6
°C/W
Thermal resistance junction-to-ambient,
θja}
2 oz. trace and copper pad without solder
44.3
°C/W
† One of the most influential components on the thermal performance of a package is board design. In order to take full advantage of the heat
dissipating abilities of the PowerPAD packages, a board must be used that acts similar to a heat sink and allows for the use of the exposed (and
solderable), deep downset pad. See Appendix A of the PowerPAD Thermally Enhanced Package application note, TI literature number
SLMA002.
‡ For both DAD and DAP packages.
RL = 6 Ω to 8 Ω
PARAMETER
MIN
NOM
MAX
UNIT
Digital
DVDD to DVSS
3
3.3
3.6
V
PVDDA2 to PVSS
16.5
22
26.5
Supply voltage
Regulator
PVDDB2 to PVSS
16.5
22
26.5
V
yg
Regulator
PVDDA2 to PVSSw
10.5
16.5
V
PVDDB2 to PVSSw
10.5
16.5
§ Connect LDROUTA to PVDDA2 and connect LDROUTB to PVDDB2. Under this condition, the H-bridge forward on-state resistance is increased.
This increases internal power dissipation. Maximum output power may need to be reduced to meet thermal conditions.
maximum available power at common load impedances for both DAP and DAD packages unclipped (0 dB)
level, test conditions described in the Thermal Methodology for the 32-Pin DAD Package 50 W, 6-
Ω Test and
Thermal Methodology for the 32-Pin DAP Package 50 W, 6-
Ω Test sections
LOAD IMPEDANCE (
Ω)
PVDAA1/PVDDB1 (VDC)
APPROXIMATE MAX OUTPUT POW-
THD+N AT MAX POWER AND 1 kHz
LOAD IMPEDANCE (
Ω)
PVDAA1/PVDDB1 (VDC)
APPROXIMATE MAX OUTPUT POW-
ER (W)
THD+N AT MAX POWER AND 1 kHz
INPUT¶
6
27
50
< 10%
6
27
43
< 0.09%
8
27
34
< 0.09%
¶ Dependent on board design and component selection.
static digital specifications
RESET, PWDN, PWM_AP, PWM_AM, PWM_BP, PWM_BM, TJ = 25°C, DVDD = 3.3 V
PARAMETERS
MIN
MAX
UNIT
High-level input voltage, VIH
2
V
Low-level input voltage, VIL
0.8
V
Input leakage current
–10
10
µA
ERR0, ERR1, SHUTDOWN, (open drain with internal pullup resistor) TJ = 25°C, DVDD = 3.3 V)
PARAMETERS
MIN
MAX
UNIT
Internal pullup resistors from SHUTDOWN, ERR0, ERR1 to DVDD
15
k
Low-level output voltage (IO = 4 mA), VOL
0.4
V



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