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TAS5110DAD Datasheet(PDF) 11 Page - Texas Instruments |
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TAS5110DAD Datasheet(HTML) 11 Page - Texas Instruments |
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11 / 20 page ![]() TAS5110 SLES028A – MAY 2002 – REVISED SEPTEMBER 2002 11 www.ti.com recommended operating conditions (maximum output power = 50 W (RMS), TJ = 25°C) thermal data† PARAMETER MIN NOM MAX UNIT Shutdown junction temperature, TJ(SD) 150 °C Warning junction temperature, TJ(W) 125 °C Operating temperature TC Commercial 0 25 70 °C Operating temperature, TC Industrial –40 25 85 °C Thermal resistance junction-to-case, θjc} 2 oz trace and copper pad without solder 1.6 °C/W Thermal resistance junction-to-ambient, θja} 2 oz. trace and copper pad without solder 44.3 °C/W † One of the most influential components on the thermal performance of a package is board design. In order to take full advantage of the heat dissipating abilities of the PowerPAD packages, a board must be used that acts similar to a heat sink and allows for the use of the exposed (and solderable), deep downset pad. See Appendix A of the PowerPAD Thermally Enhanced Package application note, TI literature number SLMA002. ‡ For both DAD and DAP packages. RL = 6 Ω to 8 Ω PARAMETER MIN NOM MAX UNIT Digital DVDD to DVSS 3 3.3 3.6 V PVDDA2 to PVSS 16.5 22 26.5 Supply voltage Regulator PVDDB2 to PVSS 16.5 22 26.5 V yg Regulator PVDDA2 to PVSSw 10.5 16.5 V PVDDB2 to PVSSw 10.5 16.5 § Connect LDROUTA to PVDDA2 and connect LDROUTB to PVDDB2. Under this condition, the H-bridge forward on-state resistance is increased. This increases internal power dissipation. Maximum output power may need to be reduced to meet thermal conditions. maximum available power at common load impedances for both DAP and DAD packages unclipped (0 dB) level, test conditions described in the Thermal Methodology for the 32-Pin DAD Package 50 W, 6- Ω Test and Thermal Methodology for the 32-Pin DAP Package 50 W, 6- Ω Test sections LOAD IMPEDANCE ( Ω) PVDAA1/PVDDB1 (VDC) APPROXIMATE MAX OUTPUT POW- THD+N AT MAX POWER AND 1 kHz LOAD IMPEDANCE ( Ω) PVDAA1/PVDDB1 (VDC) APPROXIMATE MAX OUTPUT POW- ER (W) THD+N AT MAX POWER AND 1 kHz INPUT¶ 6 27 50 < 10% 6 27 43 < 0.09% 8 27 34 < 0.09% ¶ Dependent on board design and component selection. static digital specifications RESET, PWDN, PWM_AP, PWM_AM, PWM_BP, PWM_BM, TJ = 25°C, DVDD = 3.3 V PARAMETERS MIN MAX UNIT High-level input voltage, VIH 2 V Low-level input voltage, VIL 0.8 V Input leakage current –10 10 µA ERR0, ERR1, SHUTDOWN, (open drain with internal pullup resistor) TJ = 25°C, DVDD = 3.3 V) PARAMETERS MIN MAX UNIT Internal pullup resistors from SHUTDOWN, ERR0, ERR1 to DVDD 15 k Ω Low-level output voltage (IO = 4 mA), VOL 0.4 V |
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