LVDS Interface

DLPC910

LVD Interface

RESET Signals

SCP Interface

Power Management

OSC

50 MHz

CTRL_RSTZ

JTAG(3:0)

DLPR910

PGM(4:0)

Illumination

Driver

Illumination

Sensor

I2C

Row and Block Signals

Control Signals

Status Signals

VLED0

VLED1

DLP9000X

DLP6500

Product

Folder

Sample &

Buy

Technical

Documents

Tools &

Software

Support &

Community

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

DLPR910

DLPS065B – SEPTEMBER 2015 – REVISED NOVEMBER 2016

DLPR910 Configuration PROM

1

1 Features

1

•

DLPC910ZYR

•

Data Transfer Up to 33 Mbps

•

I/O Pins Compatible With 1.8 V to 3.3 V

•

1.8-V Core Supply Voltage

•

–40°C to 85°C Operating Temperature Range

2 Applications

•

Lithography

–

Direct Imaging

–

Flat Panel Display

–

Printed Circuit Board Manufacturing

•

Industrial

–

3D Printing

–

3D Scanners for Machine Vision

–

Quality Control

•

Displays

–

3D Imaging

–

Intelligent and Adaptive Lighting

–

Augmented Reality and Information Overlay

3 Description

The DLPR910 device is a programmed PROM used

for properly configuring the DLPC910, which supports

reliable operation of the DLP9000X digital micromirror

device (DMD) and the DLP6500 family of DMDs. The

DLPR910 configuration enables the DLPC910 to

operate the DMDs at a pixel data rate greater than 61

Gigabits per second (Gbps) for the DLP9000X and up

to 24 Gbps for the DLP6500 family, with the option

for random row addressing and Load4 capabilities.

The DLPR910 device is part of a multiple component

A dedicated chipset provides developers easier

access

to

the

DMD

as

well

as

high

speed,

independent micromirror control.

The DLPC910 configuration program is only available

within the DLPR910. The DLPR910 requires that it be

used in conjunction with the DLPC910 and the

DLP9000X DMD or the DLP6500 family of DMDs for

reliable function and operation of the chipset.

For complete electrical and mechanical specifications

of

the

DLPR910,

see

the

XCF16P

product

specification at www.xilinx.com.

Device Information(1)

PART NUMBER

PACKAGE

BODY SIZE (NOM)

DLPR910

DSBGA (48)

8.00 mm × 9.00 mm ×

1.20 mm

(1) For all available packages, see the orderable addendum at

the end of the data sheet.

Figure 1. Typical Application Diagram