INA139 datasheet(17/25 Pages) TI1

17 / 25 page

OUT

V+

VIN+

VIN-

PCB pad

0.1 µF

VIA to Ground Plane

Supply Voltage

Output

PCB pad

To Bus

Voltage

To Load

GND

RSHUNT

INA139

INA169

INA139, INA169

www.ti.com

SBOS181E – DECEMBER 2000 – REVISED DECEMBER 2015

10 Layout

10.1 Layout Guidelines

Figure 19 shows the basic connection of the INA139. The input pins, VIN+ and VIN–, must be connected as closely

as possible to the shunt resistor to minimize any resistance in series with the shunt resistance. The output

resistor, RL, is shown connected between pin 1 and ground. Best accuracy is achieved with the output voltage

measured directly across RL. This is especially important in high-current systems where load current could flow in

the ground connections, affecting the measurement accuracy.

No power-supply bypass capacitors are required for stability of the INA139. However, applications with noisy or

high-impedance power supplies may require decoupling capacitors to reject power-supply noise; connect the

bypass capacitors close to the device pins.

10.2 Layout Example

Figure 19. Typical Layout Example

Submit Documentation Feedback

Product Folder Links: INA139 INA169

INA139 Datasheet(PDF) 17 Page - Texas Instruments