LM4873 datasheet(7/19 Pages) NSC

7 / 19 page

Typical Performance Characteristics

MTE-1 (28 pin) Specific Characteristics

Note 21: These curves show the thermal dissipation ability of the LM4835MTE at different ambient temperatures given these conditions:

500LFPM + 2in2: The part is soldered to a 2in2, 1 oz. copper plane with 500 linear feet per minute of forced-air flow across it.

2in2on bottom: The part is soldered to a 2in2, 1oz. copper plane that is on the bottom side of the PC board through 21 8 mil vias.

2in2: The part is soldered to a 2in2, 1oz. copper plane.

1in2: The part is soldered to a 1in2, 1oz. copper plane.

Not Attached: The part is not soldered down and is not forced-air cooled.

Non-MTE Specific Characteristics

LM4873MTE-1

THD+N vs Output Power

DS100993-97

LM4873MTE-1

THD+N vs Frequency

DS100993-99

LM4873MTE-1

THD+N vs Output Power

DS100993-96

LM4873MTE-1

THD+N vs Frequency

DS100993-98

LM4873MTE-1

Power Dissipation vs Power Output

DS100993-90

LM4873MTE-1(Note 21)

Power Derating Curve

DS100993-A0

THD+N vs Frequency

DS100993-3

THD+N vs Frequency

DS100993-4

THD+N vs Frequency

DS100993-5

LM4873 Datasheet(PDF) 7 Page - National Semiconductor (TI)