Recommended Soldering Conditions

(1) Infrared reflow soldering

• Peak reflow temperature

260 ˚C or below (package surface temperature)

• Time of peak reflow temperature

10 seconds or less

• Time of temperature higher than 220 ˚C

60 seconds or less

• Time to preheat temperature from 120 to 180°C 120±30 s

• Number of reflows

Three

• Flux

Rosin flux containing small amount of chlorine (The flux

with a maximum chlorine content of 0.2 Wt % is

recommended).

(2) Wave soldering

• Temperature

260 ˚C or below (molten solder temperature)

• Time

10 seconds or less

• Preheating conditions

120°C or below (package surface temperature)

• Number of times

One (Allowed to be dipped in solder including plastic mold portion.)

• Flux

Rosin flux containing small amount of chlorine (The flux

with a maximum chlorine content of 0.2 Wt % is recommended).

(3) Cautions

• Fluxes

Avoid removing the residual flux with chlorine-based cleaning solvent after a reflow process.

USAGE CAUTIONS

1. Protect against static electricity when handling.

2. Avoid storage at a high temperature ad high humidity.

Recommended Temperature Profile of Infrared Reflow

PS2911-1

Time (s)

180 ˚C

120±30 s

(preheating)

(heating)

to 10 s

to 60 s

260 ˚C (peak temperature)

220 ˚C

120˚C

Life Support Applications

These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably

be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and

agree to fully indemnify CEL for all damages resulting from such improper use or sale.

A Business Partner of NEC Compound Semiconductor Devices, Ltd.